CoolerMaster TPC 812 CPU Cooler

The first-ever CPU heatsink to use vertical vapor chamber technology combined with heatpipe technology: the synergy of both Technologies working in tandem delivers the top cooling performance for both Intel and AMD systems alike.

Features

• The TPC 812 uses 2 separate cooling technologies to transfer heat heat pipes and vertical vapor chambers.
• Ready for overclocking, benchmarking and silent cooling.
• The first-ever CPU heatsink to use vertical vapor chamber technology.
• 100% pure polished copper base combined with improved soldering technologies for the best thermal transfer.
• Special fin design receives concentrated cold airflow.
• Improved air pressure design and fan mounting system.

Compatible with Intel 1150, 1155, 1156, 1366 and 2011 as well as AMD Sockets FM1, AM3, AM3+, AM2 and AM2+.