The der8auer Delid-Die-Mate WS 3647 is a practical tool that can be used to remove (delid) the heatspreader for Intel Xeon Phi and Xeon Skylake SP processors. It features a lightweight design, and is made from high quality aluminum with a anodized black finish.
Features of the der8auer Delid-Die-Mate WS 3647 at a glance.
- Practical tool to remove (delid) the heatspreader of a CPU
- Quick, light and above all safe
- Made from high quality aluminium in anodized black
- Compatible with current Intel Xeon Phi and Xeon Skylake SP processors
- Overclock comfortably and safely like a pro!
Overclock easily and safely to the limit like an overclocking champion!
The benchmark grandmaster Roman "der8auer" Hartung developed for the Delid The Mate WS 3647 here as a solution to enable everyone to remove the heatspreader with ease, conveniently and safely without having to risk prematurely killing a CPU. The tool is made from robust, black anodized aluminium with long-lived high-grade steel elements. With it, the heatspreader can be safely removed in less than a minute by inserting the processor to be delidded into the Delid Die Mate WS 3647's module in accordance with the arrow labelled on the CPU. Then a section of the unit is slowly and evenly tightened by means of an Allen key, thereby loosening the heatspreader and pushing it away from the processor. With this method, users will enjoy being able to delid processors without any risk of damage.
The previously dangerous process of delidding thus becomes a harmless routine, and the sensitive silicon die and above all the other exposed components of the CPU are guaranteed to remain intact. For extreme overclockers and anyone who wants to become one, the device opens up completely new possibilities for professional CPU overclocking. The problematic additional heat transferred between the heatspreader and silicon is now completely eliminated and the CPU temperature is greatly lowered as a result, allowing the CPU to be significantly better overclocked. A further advantage is that now a higher quality thermal compound with better conductivity can and must be selected, for example from Thermal Grizzly. The results are impressive: Under load, 10 °C to 20 °C lower temperatures can be achieved.
A popular alternative is also to replace the thermal interface material itself, e.g. with liquid metal heat-conducting paste offering significantly better thermal conductivity. The heatspreader can then be reattached using silicone adhesive if required and all processor coolers can be mounted as usual. For a reliable connection between heatspreader and CPU, the third component of the Delid Die Mate WS 3647 is required, which is pushed over the mounting module and exerts pressure from above using the vice method. However, it should be noted here that too much pressure is not exerted, as otherwise the CPU could be damaged.
The removal of the CPU heatspreader is at your own risk and is always accompanied by the complete loss of the manufacturer's warranty and warranty! When using the heatspreader, make sure that it is soldered NOT to the CPU, but that only heat conducting paste has been used.
||140 x 77 x 15 mm
||CPU Heatspreader Remover
||aluminium / stainless steel
||Compatible with all Intel Xeon Phi and Xeon Skylake SP processors for socket 3647
||1 x Delid Die Mate WS 3647
1 x Hexagon socket connections
Backed by a 1 year der8auer warranty.